LTCC Ceramics — Multilayer Integration for RF & Microwave
Specialized materials engineered for high-frequency, high-reliability and demanding electronic applications. Multilayer circuits with integrated inductors, capacitors and waveguides — in a hermetic, temperature-stable ceramic package.
For Procurement
MOQ, lead time, packaging and commercial terms — go straight to a quotation.
Request a Quote →For Engineering
Grades, drawings, process data and design support for your DFM review.
Material Specifications →For Quality / SQE
Certificates, inspection planning, traceability and PPAP / FAI support per project.
Certificates & Documentation →
Why LTCC?
LTCC lets you build an entire circuit — conductors, passives, and package — in one monolithic ceramic structure.
- ✓3D integration — 10–40+ ceramic layers with through-vias, cavities, and integrated passive components — replaces entire PCB subsystems
- ✓Excellent RF performance — low dielectric loss (tan δ < 0.002 at GHz) and stable dielectric constant from -55°C to 125°C
- ✓Hermetic packaging — fired ceramic is inherently hermetic — ideal for moisture-sensitive and high-reliability applications
- ✓Thermal stability — CTE matched to silicon and compatible with chip attachment — survives -55°C to 125°C thermal cycling
Applications
| Application | Typical Spec | Why This Material |
|---|---|---|
| RF & Microwave Modules | DuPont 951 / Ferro A6M | Filters, couplers, baluns for 1–60 GHz |
| Automotive Radar | 77 GHz LTCC substrates | ADAS sensor modules with integrated antennas |
| Telecom Infrastructure | Low-loss LTCC | Base station filters and power amplifier modules |
| Medical Implants | Biocompatible LTCC | Hermetic packages for pacemakers and neurostimulators |
| Aerospace & Defense | High-reliability LTCC | Phased array radar and satellite communications |
Electrical & Material Properties
Material datasheets available for download.
| Parameter | DuPont 951 | Ferro A6M | Notes |
|---|---|---|---|
| Dielectric constant (εr) | 7.8 | 5.9 | At 1–10 GHz |
| Loss tangent (tan δ) | 0.006 | 0.002 | At GHz frequencies |
| Conductor | Ag, Au | Ag, Au | Screen-printed thick film |
| Layer count | Up to 40+ | Up to 30+ | Application-dependent |
| Min via diameter | 100μm | 100μm | Laser or punched |
| Firing temperature | 850°C | 850°C | Enables Ag/Au conductors |
LTCC vs PCB & HTCC
When LTCC is the right choice:
- ✓vs organic PCB — LTCC: hermetic, temperature-stable, lower loss at GHz — but higher cost and less reworkable; PCB: cheaper, faster iteration, fine for <5 GHz
- ✓vs HTCC (high-temp co-fired) — LTCC fires at 850°C (enables silver/gold conductors with lower RF loss) vs HTCC at 1600°C (requires tungsten/molybdenum — lossier but stronger); LTCC dominates RF, HTCC dominates extreme mechanical
- ✓vs thin-film — LTCC: multilayer 3D at moderate cost; thin-film: single-layer precision at high cost; they're complementary — thin-film on LTCC for the ultimate in integration
From Material to RF Module
From ceramic tape to fired module, every step is process-controlled:
- ✓Design — Gerber or GDSII layer files — we review for LTCC DFM rules (via aspect ratio, layer registration, cavity walls)
- ✓Tape casting / blanking — green (unfired) tape punched with vias and cavity geometry
- ✓Via fill & printing — conductive paste fills vias; traces printed on each layer
- ✓Stack, laminate, & co-fire — layers aligned, laminated under pressure, and fired at 850°C — all layers and conductors fire simultaneously
- ✓Post-processing — singulation, conductor plating, component attachment, and testing
Complete Technical Data
Full reference tables for LTCC Ceramics — migrated from our production specification library. Click any row's PDF to download the grade datasheet.
Data table 1
| Type | Characteristic | Dielectric Constant | Dielectric Loss | CTE (25–300°C) ppm/°C |
Flexural Strength ≥ MPa |
Sintering Temp °C |
|---|---|---|---|---|---|---|
| L3B9 | Low-εr, Low-Loss | 3.9 ± 0.1 (10–30 GHz) | ≤ 0.002 (10–30 GHz) | 2.3 | 100 | 850–875 |
| L4D4 | Low-εr, Low-Loss | 4.4 ± 0.1 (8–30 GHz) | ≤ 0.002 (8–30 GHz) | 4.1 | 125 | 850–875 |
| L7H4 | High Strength | 7.4 ± 0.1 (@10 GHz) | < 0.003 (@10 GHz) | 6.1 | 300 | 850–875 |
| L7AT | High-CTE, Low-Loss | 7.7 ± 0.2 (10–30 GHz) | ≤ 0.001 (10–30 GHz) | 12.5 | 200 | 875–900 |
| L15J | Mid-εr, Low-Loss | 15.0 ± 0.5 (@6 GHz) | ≤ 0.0005 (@6 GHz) | 9.6 | 150 | 875–900 |
| L40A0 | High-εr, Low-Loss | 40 ± 2 (@4 GHz) | ≤ 0.0005 (@4 GHz) | 7.9 | 150 | 875–900 |
| L68B0 | High-εr, Low-Loss | 68.0 ± 2 (@4 GHz) | ≤ 0.002 (@4 GHz) | 9.1 | 120 | 875–900 |
Data table 2
| Production Line | Annual Capacity |
|---|---|
| LTCC dielectric material powder | 150+ tons / year |
| LTCC green tape (8-inch) | 2,800,000 pieces / year |
| Electrode paste | ≈ 3 tons / year |
| 8-inch LTCC components (0603, 0.06" × 0.03") | 45,000,000+ pcs / year |
| 8-inch LTCC substrates (2" × 2") | 30,000+ pcs / year |
Application Gallery
Real applications of LTCC Ceramics across industries.
Built to Your Electrical Requirements
Layer Count
10–40 layers standard; 50+ reviewed case by case for specialized applications.
Size & Format
Substrates 5–100 mm per side; panelized on 150×150 mm for cost efficiency.
Metallization
Ag / Au thick film; Ni/Pd/Au and other finishes for wire bonding and assembly.
Electrical Spec
Filters, couplers, baluns and antennas designed to your frequency and loss targets.
Quality & Reliability
What we measure and document on LTCC programs:
- ✓Dimensional — fired dimensions, shrinkage and flatness measured per the agreed inspection plan
- ✓Material & electrical — dielectric properties and conductor verification against specification
- ✓Reliability data — thermal cycling and other reliability testing scoped per project requirements
Data Download
Technical documentation for your evaluation:
- ✓Material specifications — browse the specification library →
- ✓Datasheets & downloads — TDS and reference documents →
- ✓Project-specific data — application notes and test data available on request
Frequently Asked Questions
What are the size limits for LTCC?
Typical substrates run 5–100mm per side. Panel size (for cost efficiency) is 150×150mm — we tile your parts to maximize panel utilization. Layer count 10–40 is standard; 50+ layers possible for specialized applications.
Can you design my LTCC circuit?
Yes — our RF engineers design LTCC filters, couplers, baluns, and antenna modules from your specifications (frequency, bandwidth, insertion loss, return loss). Design services are included with production orders; standalone design projects are quoted separately.
How does LTCC compare in cost to PCB?
LTCC is 2–10× more expensive per unit than equivalent PCB at low volume. But LTCC replaces multi-PCB assemblies with a single hermetic part — at system level, total cost is often lower. Volume also closes the gap: at 100k+ pieces, LTCC becomes competitive for modules that need 4+ PCB layers.
Have a Specification or Layer Stack?
Send your engineering parameters, drawings and frequency requirements to our team for review and quotation.